data sheet semiconductor http://www.yeashin.com 1 rev.02 20120305 1SS400G switching diode absolute maximum ratings (ta = 25c) parameter symbol limits unit peak reverse voltage v rm 90 v dc reverse voltage v r 80 v peak forward current i fm 225 ma mean rectifying current i o 100 ma surge current (1s) i surge 500 ma junction temperature tj 125 c storage temperature t stg ? 55 ~ +125 c applications high speed switching features 1) extremely small surface mounting type. 2) high speed. 3) high reliability. construction silicon epitaxial planar electrical characteristics (ta = 25c) parameter symbol min. typ. max. unit conditions forward voltage v f ? ? 1.2 v i f =100ma reverse current i r ? ? 0.1 av r =80v capacitance between terminals c t ? 0.72 3.0 p f v r =0.5v , f=1mhz reverse recovery time t rr ? ? 4n s v r =6v , i f =10ma , r l =100 device marking 1SS400G= 7 pb-free package is available device marking shipping 3000/tape&reel 1SS400G 7 ordring information sod - 723 2 anode 1 cathode h
http://www.yeashin.com 2 rev.02 20120305 device characteristics 1SS400G 1 100m 10m 1m 100 10 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 forward voltage : v f (v) fig.1 forward characteristics 10 5 2 1 0.5 0.1 forwardfcurrentf:fi f f(a) 1m 0.1m 10 1 100n 10n 1n 0 20 40 60 80 100 120 reverse voltage : v r (v) fig.3 capacitance between terminals reverse voltage : v r (v) fig.2 reverse characteristics reverse current : i r (a) 02 4 6 8101214 3 2 1 0 0.1 1 10 100 1000 10,000 capacitance between terminals : c t (pf) reverse recovery time : t rr (ns) forward current : i f (ma) fig.4 reverse recovery time characteristics 100 50 20 10 5 2 1 0102030 surge current : i surge (a) pulse width : t w (ms) fig.5 surge current characteristics pulse generator output 50 ? sampling oscilloscope 50 ? fig.6 reverse recovery time (t rr ) measurement circuit 5k ? 0.01 f d.u.t.
http://www.yeashin.com 3 rev.02 20120305 package outline & dimensions 1SS400G sod?723 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. dim min nom max millimeters a 0.49 0.52 0.55 b 0.25 0.28 0.32 c 0.08 0.12 0.15 d 0.95 1.00 1.05 e 0.55 0.60 0.65 1.35 1.40 1.45 l 0.15 0.20 0.25 h e 0.019 0.020 0.022 0.0098 0.011 0.013 0.0032 0.0047 0.0059 0.037 0.039 0.041 0.022 0.024 0.026 0.053 0.055 0.057 0.006 0.0079 0.010 min nom max inches d e b c a l 2x ?y? ?x? 0.08 (0.0032) xy h e 0.45 0.0177 0.50 0.0197 1.1 0.043 mm inches scale 10:1 soldering footprint*
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